Original text is not available for public display.
Semiconductor
Necessity is the Mother of Invention: Huawei Replaces Moore’s Law With Her’s Law
EE Times · 2026-05-27
Related items
SemiconductorEE Times
Realising the Benefits of Quality Inspection Reports
However much you prototype and test your product designs, there will always be factors outside your direct control that have significant implications for the manufacturability, efficiency, reliability and expected lifespan of your final product. One of the most important of these is the quality of the PCBs you recei...
SemiconductorEE Times
From Shrinking Transistors to Compressing Time: Deciphering Huawei’s τ Law
Huawei's answer to Moore's Law without EUV promises 14A performance by 2031. The post From Shrinking Transistors to Compressing Time: Deciphering Huawei’s τ Law appeared first on EE Times .
SemiconductorSemiWiki
Engineering the Next Era of Semiconductor Innovation
The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives from Si...
SemiconductorSemiWiki
CEVA Accelerates Wireless Edge Innovation with Bluetooth HDT and Integrated RF Design Win
CEVA, the leading licensor of wireless connectivity and smart sensing technologies, is advancing its full-stack wireless strategy with the introduction of next-generation Bluetooth High Data Throughput (HDT) capabilities and a major integrated RF subsystem design win. The announcement underscores CEVA’s growing role...
SemiconductorSemiWiki
SoC PLANNER: A New Generation of SoC Design Exploration Solution Managing Cost-effectiveness and Sustainability
With over a trillion chips manufactured every year and application requirements evolving faster than ever (across automotive, HPC, and AI), the pressure on SoC design teams has never been higher with design space keeps growing and schedules keep shrinking. Indeed, for a complex SoC project, the number of possible co...
SemiconductorEE Times
LightSpeed Photonics Targets AI Data Centers With 400-Gbps Near-Packaged Optical Interconnects
The Singapore-based startup develops optical transceivers for the next generation of data center infrastructure. The post LightSpeed Photonics Targets AI Data Centers With 400-Gbps Near-Packaged Optical Interconnects appeared first on EE Times .