The semiconductor industry is entering a transformative new phase, driven by the convergence of artificial intelligence, cloud computing, and increasingly complex chip architectures. That message took center stage during the keynote talks at the Siemens EDA User2User 2026 North America conference. Executives from Si...
Related items
Realising the Benefits of Quality Inspection Reports
However much you prototype and test your product designs, there will always be factors outside your direct control that have significant implications for the manufacturability, efficiency, reliability and expected lifespan of your final product. One of the most important of these is the quality of the PCBs you recei...
Necessity is the Mother of Invention: Huawei Replaces Moore’s Law With Her’s Law
We now know what China’s been working on to counter U.S. sanctions on EUV technology. The post Necessity is the Mother of Invention: Huawei Replaces Moore’s Law With Her’s Law appeared first on EE Times .
Trusted Convergence Governance: Preserving Admissibility Integrity Across Heterogeneous Semiconductor Systems
As semiconductor systems evolve toward heterogeneous integration, chiplets, 2.5D and 3D packaging, distributed observability, runtime adaptation, Fleet Learning, and lifecycle convergence governance, the industry is entering a fundamentally new operational reality. Convergence decisions are no longer driven only… Re...
SoC PLANNER: A New Generation of SoC Design Exploration Solution Managing Cost-effectiveness and Sustainability
With over a trillion chips manufactured every year and application requirements evolving faster than ever (across automotive, HPC, and AI), the pressure on SoC design teams has never been higher with design space keeps growing and schedules keep shrinking. Indeed, for a complex SoC project, the number of possible co...
CEVA Accelerates Wireless Edge Innovation with Bluetooth HDT and Integrated RF Design Win
CEVA, the leading licensor of wireless connectivity and smart sensing technologies, is advancing its full-stack wireless strategy with the introduction of next-generation Bluetooth High Data Throughput (HDT) capabilities and a major integrated RF subsystem design win. The announcement underscores CEVA’s growing role...
GUC Showcases VSORA’s Jotunn8 AI inference Processor at the TSMC Europe Technology Symposium
Global Unichip Corp. (GUC), the Advanced ASIC Leader, will showcase Jotunn8, a next-generation data center AI inference processor developed by VSORA, at the TSMC Europe Technology Symposium. The post GUC Showcases VSORA’s Jotunn8 AI inference Processor at the TSMC Europe Technology Symposium appeared first on EE Tim...